Automotive electronics connectors, the original material requirements so harsh
However, the material used to manufacture automotive electronics connectors can be unusual. It must:
➤ In the assembly process, can withstand high temperature welding, to avoid foaming;
➤ In actual use, it withstands high-temperature environments.
Ordinary materials not work?
➤ About blistering
When exposed to high temperature environments such as reflow ovens, moisture in the part tends to rapidly convert to steam, causing blistering. Blistering can affect the assembly and impair the mechanical properties of the assembly. To avoid such problems, the connector requirements of the automotive industry are moving closer to JEDEC MSL Level 1 (Level 1 Humidity Sensitivity Level).
While some of the existing thermoplastics may also meet the JEDEC MSL Level 1 requirements, they often require compromise in performance due to material brittleness, weakness of the wire, or low heat-resistance peaks.
➤ About heat resistance at high temperatures
Some automotive electronics applications may have actual operating temperatures up to 200 ° C.
In general, iodide salts are used as thermal stabilizers for conventional materials that are suitable for these conditions. However, these additives may cause metal contact corrosion.
Without the use of iodide stabilizers, the thermal stability of the material can be significantly reduced.
A new material that addresses the above challenges - the ForTii Ace® JTX8
Introduced by DSM, this polyamide material offers the following benefits:
➤ Achieve JEDEC MSL Level 1 (Level 1 Humidity Sensitivity Level) requirements to avoid blistering problems during soldering;
➤ Design products with optimal performance and package optimization;
➤ Effectively reduce costs and optimize the assembly process for higher productivity;
➤ No halogen stabilizer but heat resistance comparable to PPA with standard copper iodide stabilizer;
➤ Easy to color and excellent color fastness at high temperatures.
➤ In the assembly process, can withstand high temperature welding, to avoid foaming;
➤ In actual use, it withstands high-temperature environments.
Ordinary materials not work?
➤ About blistering
When exposed to high temperature environments such as reflow ovens, moisture in the part tends to rapidly convert to steam, causing blistering. Blistering can affect the assembly and impair the mechanical properties of the assembly. To avoid such problems, the connector requirements of the automotive industry are moving closer to JEDEC MSL Level 1 (Level 1 Humidity Sensitivity Level).
While some of the existing thermoplastics may also meet the JEDEC MSL Level 1 requirements, they often require compromise in performance due to material brittleness, weakness of the wire, or low heat-resistance peaks.
➤ About heat resistance at high temperatures
Some automotive electronics applications may have actual operating temperatures up to 200 ° C.
In general, iodide salts are used as thermal stabilizers for conventional materials that are suitable for these conditions. However, these additives may cause metal contact corrosion.
Without the use of iodide stabilizers, the thermal stability of the material can be significantly reduced.
A new material that addresses the above challenges - the ForTii Ace® JTX8
Introduced by DSM, this polyamide material offers the following benefits:
➤ Achieve JEDEC MSL Level 1 (Level 1 Humidity Sensitivity Level) requirements to avoid blistering problems during soldering;
➤ Design products with optimal performance and package optimization;
➤ Effectively reduce costs and optimize the assembly process for higher productivity;
➤ No halogen stabilizer but heat resistance comparable to PPA with standard copper iodide stabilizer;
➤ Easy to color and excellent color fastness at high temperatures.
