The color of the connector gold-plated layer is different from the normal color of the gold layer, or the color of the gold layer of the different parts in the same ancillary product is different. The reason for such a problem is as follows:
1. Gold-plated raw material impurities When added to the chemical bath of the material into the impurities more than the endurance of gold-plated liquid will quickly affect the color and brightness of the gold layer. If the organic impurities affect the appearance of the dark gold hair and hair Phenomenon, Hao Er tank test piece dark hair and hair position is not fixed.If the metal impurities interfere with the current density will result in narrow the effective range, the Haier tank test shows that the current density of the test piece is not bright or high-end plating is not Bright low-end plating is not reflected on the coating is plated red or even black, the color of the hole changes more clearly.
2. Gold plating current density is too large As the plating tank parts of the total area of the wrong calculation of its value is greater than the actual surface area, so that the gold plating current is too large, or the use of vibration plating gold amplitude is too small, so all or part of the tank plating gold Coated crystal rough, red eyes gold.
3. Aging gold plating solution Aging gold plating solution is too long, then excessive accumulation of impurities in the bath is bound to cause the color of the gold layer is not normal.
4. Hard gold plating alloy content changes In order to improve the connector's hardness and wear resistance, gold-plated connectors are generally used hard gold plating process which uses more of the gold-cobalt alloy and gold-nickel alloy. When the bath If the content of cobalt and nickel changes will cause the gold coating color change.If the cobalt content is too high, the color of the gold layer will be reddish; if the nickel content in the bath is too high, the metal color will be shallow; Variety is too large and different parts of the same ancillary products are not plated in the same slot, so there will be provided to the user the same batch of gold color products are not the same color phenomenon.
5. Hole plated with gold pins or jack connector After the gold plating process is completed or the thickness of the outer surface of the plating thickness reaches the specified value, the wire hole or jack hole plating thin or no gold layer .
6. When plated with gold plating on each other In order to ensure that the connector jack in the plug in the use of plug-in has some flexibility in the product design, most types of jacks are designed in the mouth of a slot. Plated parts of the plating process is constantly turning some of the jacks in the opening at each other so that the power part of the plug in each other to shield the hole caused by difficult plating holes.
7. When plating the end to end plating of some types of connectors its pin in the design of its needle diameter is slightly smaller than the outer diameter of wire hole size, part of the plating process will be formed in the end to end contact Resulting in the wire hole does not enter the gold plated (see the picture) These two phenomena are more likely to occur in vibration gold plating.
8. blind hole part of the concentration of more than plating process deep plating capacity due to the bottom of the slot at the bottom of the slot from the bottom of the hole there is still some distance, this distance objectively formed a blind hole. The same pin and jack welding There is also a blind hole in the wire hole that serves as a guide for wire bonding, which is difficult to flow when the hole diameter is small (often less than 1 mm or even less than 0.5 mm) and the blind hole concentration exceeds the hole diameter Into the hole, the flow into the hole in the bath and difficult to flow, so the hole in the quality of the hard to guarantee.
9. Gold-plated anode area is too small When the connector is small, relatively speaking, single-slot plating the total surface area is larger, so that when the small-size pinhole plating pieces plated more if the original anode area is not enough In particular, when the platinum titanium mesh is used for too long, too much platinum loss, the effective area of the anode will be reduced, so it will affect the plating ability of deep plating, plating will not enter the hole into the hole.
10. poor adhesion of the coating after plating test connector adhesion, and sometimes meet some of the pins at the front of the needle when bending or pinhole hole when the flattening of the coating Skin phenomenon, sometimes in high temperature (2000 hours) test found that the gold layer has a very small bubbling phenomenon.
11. Pre-plating pre-treatment is not complete For small pinholes, if the machining sequence is not immediately after the use of trichlorethylene ultrasonic degreasing cleaning, then the next conventional plating pretreatment is difficult to dry the hole oil Net, so that the hole coating adhesion will be greatly reduced.
12. Substrate before activation is not fully activated In the connector base material extensive use of various types of copper alloys, these copper alloys such as iron, lead, tin, beryllium and other trace metals in the general activation of the liquid is difficult to activate, if you do not use the corresponding Activated acid, in the electroplating, the metal oxide with the coating is difficult to combine, thus causing the phenomenon of high temperature foaming coating.
13. Low plating solution When using nickel sulfamate nickel plating solution, when the nickel content is lower than the technological range, the quality of the plating in the small pinhole will be affected. If the gold content of the pre-plating solution is too high Low, then when the gold-plated hole may not be plated with gold, when the plating into the thick gold plating solution, the holes within the metal layer of the plating layer of the nickel layer has been passivated the result is the gold layer within the hole Poor combination of nature.
14. slender pin plating is not reduced when the current density When plated slender shape pin, if the usual use of current density plating, the tip of the coating will be much thicker than the needle bar, the needle under the magnifying glass observed sometimes Once the match head shape (see Figure 3) the coating of the head and neck that is, the top of the front pin pin point after the gold coating adhesion test failed .This phenomenon prone to vibration plating.
Vibration plating vibration frequency adjustment is not correct Vibration plating plating insert, if the vibration frequency adjustment is not correct in nickel plating plating beating too fast, easy to open double Nickel on coating binding force.